Component mounting machine for preventing release fail of a component

ABSTRACT

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/574,891 filed Nov. 17, 2017, the entire contents of which isincorporated herein by reference. U.S. application Ser. No. 15/574,891is a 371 of International Application No. PCT/JP2015/066067 filed Jun.3, 2015.

TECHNICAL FIELD

The present disclosure relates to a component mounting machine thatdeals with a release failure of a component which has been picked up andheld.

BACKGROUND ART

For example, a mounting head that is provided with a suction nozzle formounting an electronic component onto a circuit board is installed in anelectronic component mounting machine, and an electronic component to bepicked up and held by the suction nozzle is taken out from a componentsupply section and mounted onto the circuit board. The picking up andholding of the electronic component by the suction nozzle is performedby applying negative pressure inside the nozzle via vacuum pumping aftera suction port has contacted the electronic component. The electroniccomponent which is taken out from a component supply device by suchpickup and holding is moved to the circuit board by the movement of themounting head, and after the electronic component has been placed at apredetermined position on the circuit board, the electronic component isreleased by the vacuum pumping at the suction nozzle being canceled.

CITATION LIST Patent Literature

PTL 1: JP-A-8-250897

PTL 2: JP-A-2011-159964

SUMMARY

In the component mounting machine described above, the electroniccomponent is released by the canceling of the vacuum pumping; however,the electronic component may not separate from the suction port and mayremain held without being mounted onto the circuit board. In such acase, a so-called remained-on-nozzle phenomenon occurs in which theelectronic component is lifted up while adhering to the suction nozzleas the suction nozzle is lifted, and the electronic component maysubsequently fall in the middle of the movement of the mounting head.Thus, there is a problem of an electronic component falling onto thecircuit board and causing detrimental influence such as a reduction inquality or a production defect for the produced board.

In PTL 1 and 2, in addition to the mounting work onto the circuit board,a component measurement instrument that performs component measurementof the electronic component is disclosed. With the component measurementinstrument, the electronic component is carried by the mounting headand, in the same manner, the electronic component released by cancelingthe vacuum pumping is set at a measurement location. However, with thecomponent measurement instrument, since solder, flux, or the like is notapplied as with component mounting onto a circuit board, the electroniccomponent remains on the suction nozzle more easily. In this case too,the electronic component may fall in the middle of movement due to theelectronic component remaining on the suction nozzle, again causingdetrimental influence such as a reduction in quality or a productiondefect for the produced board.

Therefore, in order to solve the problem, an object of the presentdisclosure is to provide a component mounting machine that deals theproblem of a component remaining on the mounting head.

A component mounting machine according to an aspect of the presentdisclosure includes a board conveyance device configured to convey aboard to a predetermined position, a component supply device configuredto accommodate multiple components therein, a component mounting device,on which a mounting head capable of picking up and holding a componentby vacuum pumping of a suction nozzle is installed, configured to mounta component taken out from the component supply device onto a boardconveyed by the board conveyance device, and a control device configuredto control each of the devices, in which in the component mountingdevice, through drive control of the control device, a lowering step oflowering the component, a component release step of releasing thecomponent are performed with respect to the suction nozzle of themounting head, and subsequently, a first lifting step of lifting thecomponent to a middle height, a component pickup step performed at theheight of the first lifting step, and a second lifting step after thecomponent pickup step are performed.

According to the present disclosure, through the drive control of thecontrol device with respect to the component mounting device, after thecomponent which is picked up and held by the suction nozzle is loweredand released, since the lifting of the suction nozzle is divided intothe first lifting step and the second lifting step and the componentpickup step of picking up and holding the component is performed in themiddle, even if, hypothetically, the component remains on the suctionnozzle, action of to pick up and hold the component is performed again.Accordingly, it is possible to prevent detrimental influence whichoccurs when the electronic component falls in the middle due to theelectronic component having remained on the nozzle.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an external appearance perspective view with partialtransparency illustrating an embodiment of a component mounting machine.

FIG. 2 is a side view illustrating an internal structure of a mountinghead.

FIG. 3 is a block diagram illustrating an outline of a control device ofthe component mounting machine.

FIG. 4 is, among drive control by a work program, a control flow diagramof the mounting head performed with respect to a component measurementinstrument.

FIG. 5 is a side view illustrating a state in which an electroniccomponent is disposed in the component measurement instrument.

DESCRIPTION OF EMBODIMENTS

Next, a description will be given of an embodiment of the componentmounting machine according to the present disclosure with reference tothe drawings. In the present embodiment, a description will be givenusing an electronic component mounting machine that mounts an electroniccomponent onto a circuit board as an example. FIG. 1 is an externalappearance perspective view with partial transparency illustrating theelectronic component mounting machine. The view illustrates multipleelectronic component mounting machines 1 lined up in a width direction,circuit boards being conveyed in order in the inner portion of each ofthe electronic component mounting machines 1, and predeterminedelectronic components being mounted in each of the electronic componentmounting machines 1. FIG. 1 illustrates two electronic componentmounting machines 1 installed on base 100; however, the number ofelectronic component mounting machines 1 can be changed freely accordingto the manufacturing content.

Electronic component mounting machine 1 includes a large openings in thesides in the width direction and transferring of the circuit boards isperformed between adjacent electronic component mounting machines 1through the openings. Regarding the directions given in the followingdescription, as illustrated in FIG. 1, the width direction of electroniccomponent mounting machine 1 which is the direction in which the circuitboards are conveyed is an X-axis direction, a longitudinal direction ofelectronic component mounting machine 1 which is perpendicular to theX-axis direction is a Y-axis direction, and a height direction ofelectronic component mounting machine 1 is a Z-axis direction.

Board conveyance device 2 which conveys circuit boards is present at thecenter portion of electronic component mounting machine 1 in thelongitudinal direction and component supply device 3 which supplieselectronic components is configured at the front side as shown in thedrawing (the front side of electronic component mounting machine 1).Component mounting device 4 provided with a driving mechanism is alsoprovided. Component mounting device 4 includes mounting head 15 whichperforms picking up, holding, and releasing of electronic components,and moves mounting head 15. In electronic component mounting machine 1,board conveyance device 2, component supply device 3, component mountingdevice 4, and the like are assembled onto mounting machine main body101, and main body cover 102 which covers board conveyance device 2,component supply device 3, component mounting device 4, and the like isformed integrally with mounting machine main body 101.

In board conveyance device 2, two conveyance sections 201 and 202 of thesame configuration are provided lined up and the conveyance of thecircuit boards and the mounting work of the electronic components ontothe circuit boards are performed at two locations. Each of theconveyance sections 201 and 202 has a pair of guides installed inparallel to match the width dimension of the circuit boards and isprovided with a conveyor for moving the circuit board in the X-axisdirection on the guides. In component supply device 3, device table 12is installed on the front opening section of mounting machine main body101, and multiple tape feeders 11 are installed on device table 12. Intape feeder 11, a tape which accommodates electronic components isunwound from a reel and the electronic components are supplied to acomponent supply position inside the machine one at a time.

The electronic components which are supplied by component supply device3 are picked up by component mounting device 4 and mounted onto thecircuit boards. Component mounting device 4 is configured such thatmounting head 15 which handles the electronic components is capable ofmoving over an XY-plane. Two Y-axis rails 16 are fixed in parallel to aceiling portion and Y-axis slider 17 is attached to Y-axis rails 16 toslide freely. Nut 18 is fixed to Y-axis slider 17, screw shaft 20 whichis connected to Y-axis servomotor 19 passes through and screws into nut18, thus configuring a ball screw mechanism.

FIG. 2 is a side view illustrating the internal structure of mountinghead 15. A vertical pair of X-axis rails 21 is formed on Y-axis slider17 and X-axis slider 22 is attached to the X-axis rails 21 to slidefreely. Mounting head 15 is installed on X-axis slider 22. An X-axisservomotor is fixed to Y-axis slider 17, screw shaft 23 which isconnected to the output shaft of the X-axis servomotor passes throughand screws into nut 24 which is fixed to X-axis slider 22, thusconfiguring a ball screw mechanism.

Upper and lower frames 25 and 26 protrude horizontally from X-axisslider 22 and turning motor 27 and lifting and lowering motor 28 areattached to upper frame 25 with the output shafts thereof orientedvertically downward. Rotation shaft 29 which is disposed in the verticaldirection is connected to the output shaft of turning motor 27 andnozzle holder 31 is fixed to the lower end portion of the output shaftwhich passes through frames 25 and 26. Multiple suction nozzles 32 areattached to nozzle holders 31 on a circumference centered on the axialcenter of rotation shaft 29.

Each of the suction nozzles 32 is formed integrally with spindle 33which passes through nozzle holder 31 in the up-down direction and iscapable of sliding. Spring 36 is provided between nozzle gear 35 whichis fixed to the upper end portion of spindle 33 and nozzle holder 31,and spindle 33 is always biased upward. However, since flange section331 of spindle 33 comes into contact with the lower face of nozzleholder 31 and movement upward is restricted, suction nozzle 32 isnormally positioned at the illustrated upper limit positions. Nozzlegear 35 is configured such that the rotation of servomotor 41 istransmitted via gears 37, 38, and 39 such that all of the suctionnozzles 32 rotate at once on their own axes.

Screw shaft 42 is connected to the output shaft of lifting and loweringmotor 28. Screw shaft 42 is supported by bearings which are provided onupper and lower frames 25 and 26 to rotate freely. Guide rod 43 which isdisposed vertically is fixed to frames 25 and 26 and nozzle lever 45 isattached to guide rod 43 to slide freely. Nut 46 is fixed to nozzlelever 45, screw shaft 42 passes through and screws into nut 46, thusconfiguring a ball screw mechanism. Hand section 451 which pressesspindle 33 from above is formed on nozzle lever 45, and due to nozzlelever 45 moving up and down through the driving of lifting and loweringmotor 28, suction nozzle 32 is caused to move up and down via handsection 451.

In mounting head 15, bracket 47 is fixed to frame 26 and nozzle camera48 which images an electronic component P which is held by suctionnozzle 32 is provided. Therefore, in electronic component mountingmachine 1 of the present embodiment, it is possible to determine whetherthe electronic component P is present or absent on the distal end ofsuction nozzle 32 due to the holding or the releasing by mounting head15. Therefore, in mounting head 15, a detection device is configured inwhich light which is emitted from LED 49 is reflected by reflective body51 to the rear of the electronic component P, further passes throughreflecting prism 52 inside the bracket 47, and enters nozzle camera 48.

Also, a control device for controlling the driving of the each ofdevices is provided in the electronic component mounting machine 1. FIG.3 is a block diagram illustrating an outline of the control device.Control device 5 includes controller 61 and is provided with drivecircuits 62 which are for driving drive means such as servo motors whichconfigure board conveyance device 2, component supply device 3, andcomponent mounting device 4. The main component of controller 61 is acomputer which is provided with a CPU and storage devices such as a ROM,a RAM, and a non-volatile memory. Controller 61 is connected to thedrive means of each of the devices via drive circuits 62. Controller 61is also connected to display device 6, nozzle camera 48, componentcamera 55, and the like.

In controller 61, various data processing is performed by the CPU and asystem program is stored in the ROM which is a storage device. Byreading out the system program using the CPU, the control management isperformed for all of the driving sections of electronic componentmounting machine 1. Calculation data and display data are temporarilystored in the RAM and component mounting programs, various parameters,and the like for creating the electronic circuit boards which are theproduction target are stored in the non-volatile memory which issimilarly a storage device. In particular, in the present embodiment, awork program which performs the pickup operation again after thereleasing of the electronic component by mounting head 15 is stored inthe non-volatile memory.

Next, a description will be given of operations of electronic componentmounting machine 1 of the present embodiment. The circuit board which iscarried into the machine inner portion of electronic component mountingmachine 1 is conveyed to the working position and is positioned by boardconveyance device 2. Mounting head 15 moves to a predetermined positionthrough the driving of component mounting device 4, and through thelifting and lowering of suction nozzle 32, the electronic component istaken out from component supply device 3 and mounting onto the circuitboard is performed. At this time, in mounting head 15, turning motor 27is driven and the indexing of suction nozzles 32 corresponding to theelectronic components is performed. The electronic components are imagedby nozzle camera 48 and recognition of the presence, the type, and thelike of the electronic components from the captured image data isperformed.

In mounting head 15 which is moved to a predetermined position throughthe driving of component mounting device 4, the lifting and lowering ofsuction nozzle 32 is performed when picking up, holding, and releasingthe electronic component. The rotation of lifting and lowering motor 28is converted into linear motion by the ball screw mechanism and thelifting and lowering of suction nozzle 32 is performed by nozzle lever45 causing spindle 33 to move up and down. In suction nozzle 32, theelectronic component is picked up and held to the suction port of thedistal end by vacuum pumping and the electronic component is releasedfrom the suction port through canceling of the vacuum pumping.

However, since the releasing of the electronic component is carried outby merely canceling the vacuum pumping and the electronic component isnot actively removed from the suction nozzle 32, the so-calledremained-on-nozzle phenomenon in which the electronic component remainsheld by the suction nozzle 32 may occur. This means a problem such as aproduction defect or the like may occur due to the electronic componentfalling while being moved. In particular, in the component mountingmachine of the present embodiment, component measurement instrument 56is installed between board conveyance device 2 and component supplydevice 3 as illustrated in FIG. 1. In component measurement instrument56, since the electronic component is simply placed and solder, flux, orthe like is not applied as in the case of the circuit board, theelectronic component remains on the nozzle more easily. Therefore, inthe present embodiment, a work program to counter the remained-on-nozzleproblem during the component measurement process which is performed bycomponent measurement instrument 56 is stored in controller 61.

FIG. 4 is, among drive control by a work program, a control flow diagramof the mounting head performed with respect to a component measurementinstrument. FIG. 5 is a side view illustrating a state in which theelectronic component is disposed in component measurement instrument 56.Component measurement instrument 56 measures the values of theinductance, the capacitance, and the resistance which are the electricalproperties of the electronic component, and accordingly, it is possibleto determine whether the electronic component which is taken out fromcomponent supply device 3 by suction nozzle 32 is the planned electroniccomponent. Therefore, in a case in which the reel in each of the tapefeeders 11 is newly changed during startup or during the operation ofelectronic component mounting machine 1, the electronic component whichis first taken out from the tape is first carried to componentmeasurement instrument 56 in order to determine whether the electroniccomponent is the planned electronic component.

In the component measurement process which is performed by componentmeasurement instrument 56, mounting head 15 moves to the componentsupply position of the corresponding tape feeder 11 through the drivingof component mounting device 4, suction nozzle 32 is lowered to pick upand hold the electronic component, and then suction nozzle 32 is lifted(S101). Since suction nozzle 32 is in a vacuum pumped state during thetransferring of the electronic component, the electronic component isstable in a state of being held by suction nozzle 32. After mountinghead 15 moves to component measurement instrument 56 and is positioned(S102), suction nozzle 32 is lowered via spindle 33, and as illustratedin FIG. 5, the electronic component P is disposed inside componentmeasurement section 561 of component measurement instrument 56 (S103).

Component measurement section 561 of component measurement instrument 56is formed in a trapezoid shape and the electronic component P isdisposed at the lowest part of the bottom section. After the dispositionof the electronic component P, the vacuum pumping of suction nozzle 32is canceled (S104) and a first lifting of suction nozzle 32 is performed(S105). In the first lifting, the distal end of suction nozzle 32 is ata height within component measurement section 561. This is so that, in acase in which the electronic component remains held by suction nozzle32, the separated electronic component P does not fall onto the adjacentparts camera 55 or the like. In the present embodiment, a depth D ofcomponent measurement section 561 is 4.5 mm; however, a height H of thefirst lifting is a position at which suction nozzle 32 is lifted by 2.5mm from the state illustrated in FIG. 5.

In the first lifting, drive control is performed at a lower speed thanin the following second lifting. This is so that, in a case in which theelectronic component P remains held by suction nozzle 32, the electroniccomponent P does not fall in the middle of the lifting. This is because,in a case in which the measurement is performed in a state in which theelectronic component P has fallen and the orientation of the electroniccomponent is not correct, it becomes impossible to distinguish as towhether the value is due to a defect of the electronic component itselfor a measurement defect caused by the incorrect orientation. Re-pickupof suction nozzle 32 which stops temporarily after the first lifting isperformed using vacuum pumping (S106). At this time, if the electroniccomponent P is adhering to the distal end of suction nozzle 32, theelectronic component P is picked up and held again and the state isstabilized.

Meanwhile, in a case in which the electronic component P is not adheringto the distal end of suction nozzle 32, only simple suction of air isperformed; however, since it is not possible to determine the presenceof the electronic component P at this stage, the vacuum pumping iscontinued. Therefore, the second lifting of suction nozzle 32 isperformed in a state in which the re-pickup is being performed (S107).The second lifting is lifting at normal speed since the electroniccomponent P is being held by vacuum pumping. After the second lifting,since the distal end of suction nozzle 32 is at the position illustratedin FIG. 2, the presence of the electronic component P is determined fromthe captured image data which is acquired by nozzle camera 48 (S108).Therefore, in a case in which the electronic component P is being heldby suction nozzle 32 (S108: YES), discarding of the electronic componentP is performed (S109).

As illustrated in FIG. 1, in electronic component mounting machine 1, inaddition to component measurement instrument 56, component camera 55,nozzle station 57, and collection box 58 are installed between boardconveyance device 2 and component supply device 3. Therefore, in adiscarding step, mounting head 15 moves above collection box 64, thevacuum pumping is canceled, and thus, the electronic component which isseparated from suction nozzle 32 falls into collection box 64. Theelectronic component P which is released midair falls under its ownweight.

In this manner, in a case in which the electronic component P isdiscarded and the target measurement is not achieved, the steps S101 toS107 are repeated. In other words, after the discarding of theelectronic component is completed, the electronic component is taken outfrom the relevant tape feeder 11 again and is carried to componentmeasurement instrument 56. Meanwhile, if the electronic component is notheld by suction nozzle 32 according to the determination (S108: NO), thenext process is performed. For example, as a result of the measurement,in a case in which the electronic component is the planned electroniccomponent, the process transitions to the component mounting process formounting the electronic component onto the circuit board, and in a casein which the electronic component is not the planned electroniccomponent, since exchanging the tape feeder becomes necessary, theprocess transitions to a standby process.

Note that, in electronic component mounting machine 1 of the presentembodiment, nozzle camera 48 for determining the presence of theelectronic component is installed on mounting head 15. However, thereare also electronic component mounting machines not installed withnozzle camera 48. Even in such an electronic component mounting machine,an electronic component which remains on the nozzle must be reliablydiscarded. Therefore, in an electronic component mounting machine inwhich nozzle camera 48 is not installed, regardless of whether or notthe electronic component remains on the nozzle, in all cases, thediscarding step of the electronic component is performed. In otherwords, the step S108 of the control flow illustrated in FIG. 4 isomitted, and after the steps S101 to S107 are performed, a componentdiscarding step of S109 is performed.

Specifically, mounting head 15 which completes the second lifting ofsuction nozzle 32 moves above collection box 64 in a state in which thevacuum pumping is being performed regardless of the presence or absenceof the electronic component and cancels the vacuum pumping. In a case ofa remained-on-nozzle state, the electronic component is separated fromsuction nozzle 32 and falls into the collection box 58, and in a casewhere an electronic component is not being held, nothing occurs. In acase in which the electronic component remains on the nozzle, since ameasurement error determination is assumed for the electronic component,the electronic component which is taken out from the relevant tapefeeder 11 again is carried to component measurement instrument 56 andthe steps S101 to S107 are repeated. Meanwhile, in a case in which themeasurement of the electronic component is performed, the next processis performed based on a measurement complete signal.

In the work program which is described earlier, a description is givenof a case which deals with an electronic component remaining on thenozzle after a component measurement process; however, the control ofthe component measurement process illustrated in FIG. 4 may be performedas control of the component mounting process of an electronic componentonto a circuit board. The electronic component remains on the nozzleeasily at component measurement instrument 56 as described earlier, butthe problem does not occur easily during the mounting process of theelectronic component since solder or the like is applied to the circuitboard. However, the likelihood is not zero, and in a case in which theelectronic component remains on the nozzle, a detrimental influence tothe produced board or the like may occur due to a fallen electroniccomponent. Accordingly, even in a component mounting process which isperformed on the circuit board, it is valid to perform a similar controlprocess to that of the component measurement process illustrated in FIG.4.

In the component mounting process, the electronic component is picked upand held by suction nozzle 32 from the corresponding tape feeder 11(S101), and after mounting head 15 is moved to the mounting position onthe circuit board (S102), the mounting of the electronic component ontothe circuit board is performed by the lowering of suction nozzle 32 andthe releasing of the electronic component (S103 and S104). Subsequently,the first lifting of suction nozzle 32 is performed (S105) and re-pickupby vacuum pumping is performed at suction nozzle 32 which stopstemporarily (S106).

The second lifting of suction nozzle 32 is performed (S107) and thepresence of the electronic component is determined from the capturedimage data which is acquired by nozzle camera 48 (S108). In a case inwhich the electronic component is being held by suction nozzle 32, adiscarding process is performed (S108: YES and S109) and the steps S101to S107 are repeated for the electronic components of the relevant tapefeeders 11 again. Meanwhile, if the electronic component is not beingheld by suction nozzle 32 according to the determination, the componentmounting process is performed for the next electronic component (S108:NO).

In electronic component mounting machine 1, in a case in which nozzlecamera 48 is not installed on mounting head 15, the step S108 of theflow illustrated in FIG. 4 is omitted, and after the steps S101 to S107are performed, the discarding of the electronic component is performedin S109. However, in the component mounting process, the presence of theelectronic component is determined by the electronic component passingover component camera 55. As a result, if the electronic component isnot being held by suction nozzle 32, the component mounting of adifferent location is performed in the next process, and if theelectronic component is being held by the suction nozzle 32, themounting of the electronic component to the same location is performedagain in the next process.

Therefore, according to electronic component mounting machine 1 of thepresent embodiment, even if the remained-on-nozzle phenomenon of theelectronic component occurs in the component measurement process or thecomponent mounting process, since after the first lifting (S105), there-pickup of the electronic component (S106) is performed, it ispossible to prevent detrimental influence such as a lowering of qualityor a production defect of the produced board and imaging problems bycomponent camera 55 caused by the electronic component falling. Since itis possible to achieve such an effect with an unchanged electroniccomponent mounting machine of the related art by merely changing to aprogram with the steps illustrated in FIG. 4 added, it is possible torealize the effect at low cost. In electronic component mounting machine1, since nozzle camera 48 is installed on mounting head 15, since it ispossible to determine the remained-on-nozzle of the electronic componentat a point in time of the second lifting, it is possible to omit thesubsequent discarding process and transition to the next process, whichshortens the time taken.

Although a description of an embodiment of the present disclosure isgiven above, the present invention is not limited thereto, and may besubjected to various modifications in a range not departing from thegist of the present disclosure. For example, a description is givenusing electronic component mounting machine 1 which mounts electroniccomponents onto circuit boards as an example of a component mountingmachine; however, other component mounting machines may be used.Therefore, the component measurement process and the component mountingprocess are given as examples of situations in which theremained-on-nozzle phenomenon of the components occurs; however, in acase in which the remained-on-nozzle phenomenon occurs in anotherprocess, it is also possible to adopt the present disclosure for thatprocess.

REFERENCE SIGNS LIST

1: electronic component mounting machine, 2: board conveyance device, 3:component supply device, 4: component mounting device, 5: controldevice, 15: mounting head, 32: suction nozzle, 48: nozzle camera, 56:component measurement instrument, 58: collection box

The invention claimed is:
 1. A component handling system comprising: ahead configured to pick up and hold a component by vacuum pumping of asuction nozzle provided on the head; and a control device configured tocontrol the head to: pick up the component and set the suction nozzle ofthe head in a vacuum pumped state to hold the component, move thesuction nozzle to a predetermined position while holding the component,lower the suction nozzle while holding the component, cancel the vacuumpumped state of the suction nozzle of the mounting head to attempt arelease of the component, lift the suction nozzle to a first height, setthe suction nozzle of the head to the vacuum pumped state while thesuction nozzle is at the first height so that the suction nozzle holdsthe component if the release of the component failed, and lift thesuction nozzle from the first height while the suction nozzle is in thevacuum pumped state.